logo
Greek
Μας ελάτε σε επαφή με

Υπεύθυνος : Sally Mao

Τηλεφωνικό νούμερο : 86-755-27374847

Το WhatsApp : +8618277967574

Free call
Αρχική Σελίδα ΠροϊόνταΥβριδικός πίνακας PCB10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
Επικοινωνήστε

10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias

Μάρκα: Rogers Αριθμό μοντέλου: RO4350B + Tg170 TU-768 FR4

Περιγραφή προϊόντων

This article presents a detailed design strategy for a 10-layer hybrid RF PCB that combines the exceptional high-frequency performance of Rogers RO4350B™ on both the top and bottom layers with the high thermal reliability and cost-effectiveness of Tg170 TU-768 FR4 in the inner layers. This hybrid construction is specifically engineered to meet the demands of complex RF/microwave modules requiring symmetric high-frequency performance, multiple SMT reflow cycles, and reliable

Μπορεί να είσαι σε αυτά
Ελάτε σε επαφή μαζί μας

Εισάγετε το μήνυμά σας

sales30@bichengpcb.com
+8618277967574
BTL_SallyMao
.cid.455f73688e64dff1
431959212
86-755-27374847