RO4003C High-Frequency Laminate PCB – 6-Layer Hybrid Stack-Up, 1.74mm, Hard Gold, Blind Vias, IPC Class 3 for Automotive Radar & 5G

What is RO4003C?

It's a high-performance hydrocarbon ceramic laminate from Rogers Corporation, designed for superior high-frequency performance with a dielectric constant (Dk) of 3.38 ±0.05 and an ultra-low dissipation factor (Df) of 0.0027 @ 10 GHz. Unlike PTFE-based materials, RO4003C can be fabricated using standard FR-4 epoxy/glass processes — no specialized via preparation (such as sodium etch) is required. With a Tg >280°C, Td of 425°C, and a Z-axis CTE of 46 ppm/°C that closely matches copper, it delivers exceptional thermal reliability and plated through-hole integrity.

What PCB can you build with it?

We offer a complete 6-layer hybrid multilayer PCB solution based on RO4003C combined with Tg 170°C FR-4 prepreg and core, featuring a 1.74 mm finished thickness, 1 oz copper per layer, hard gold plating, green solder mask with white silkscreen, blind vias (L1–L2 and L5–L6), 25 µm hole wall copper (IPC Class 3), and impedance control — ideal for RF/microwave, aerospace, automotive radar, and 5G infrastructure applications.

Material Overview

The RO4003C® is part of Rogers Corporation's RO4000® series of hydrocarbon ceramic laminates, specifically engineered to deliver superior high-frequency performance while maintaining cost-effective circuit fabrication. The material represents a breakthrough for RF/microwave designers because it offers the electrical performance of specialized high-frequency materials with the processability of standard FR-4.

Key Technology Highlights:

Hydrocarbon Ceramic Composite — A rigid thermoset laminate that combines low dielectric loss with excellent mechanical properties

FR-4 Process Compatibility — Unlike PTFE-based materials, RO4003C requires no specialized via preparation (e.g., sodium etching) and can be processed with standard automated handling systems

Exceptional Thermal Stability — With a Tg >280°C, the material maintains stable expansion characteristics across the entire circuit processing temperature range

Low TCDk — The temperature coefficient of dielectric constant (+40 ppm/°C) is among the lowest of any circuit board material, ensuring stable performance across temperature variations

Excellent Dimensional Stability — CTE closely matches copper, enabling mixed dielectric multilayer board constructions and reliable plated through-hole quality even in severe thermal shock applications

RO4003C Technical Data Sheet

Application Fields

RO4003C is trusted across high-frequency and high-reliability industries:

Digital applications such as servers, routers, and high speed back planes

Cellular base station antennas and power amplifiers

LNB’s for direct broadcast satellites

Custom Multilayer PCB – Complete Specification

Based on RO4003C with a hybrid FR-4 stack-up, we offer a complete 6-layer PCB solution with the following specifications:

Stack-Up Configuration

Board Specifications

Blind Via Configuration

Hybrid Stack-Up Advantages

What This PCB Excels At

Impedance Control

Q1: What makes RO4003C different from PTFE-based high-frequency laminates?

A: RO4003C is a hydrocarbon ceramic thermoset material that offers the high-frequency performance of PTFE but can be processed using standard FR-4 equipment. Unlike PTFE, it requires no specialized via preparation (e.g., sodium etching), supports automated handling, and is rigid — not flexible like PTFE. This significantly reduces fabrication cost and lead time while delivering comparable electrical performance.

Q2: Can RO4003C be used in a hybrid stack-up with FR-4?

A: Yes, and it's a common design practice. The CTE of RO4003C (X: 11, Y: 14, Z: 46 ppm/°C) is compatible with FR-4, enabling reliable hybrid constructions. Our 6-layer example uses RO4003C for outer high-frequency layers and FR-4 for inner layers, optimizing cost and performance.

Q3: What is the difference between "Process Dk" and "Design Dk"?

A: Process Dk (3.38 ±0.05) — The Dk value measured under standardized IPC test conditions. This is the guaranteed tolerance value for production consistency.

Design Dk (3.55) — An average value calculated from multiple production lots for use as a starting point in impedance design. This value accounts for real-world production variations.

For impedance calculations, designers typically use the design Dk as a starting point and then fine-tune based on actual coupon measurements.

Q4: Is RO4003C compatible with blind and buried vias?

A: Yes. RO4003C supports both laser drilling and mechanical drilling for blind vias. Our example includes L1–L2 and L5–L6 blind vias. The material's thermoset nature provides clean via walls with minimal smear, and sequential lamination can be performed thanks to the high Tg (>280°C).

Q5: Does RO4003C have a UL94 flammability rating?

A: RO4003C does not carry a standard UL94 V-0 rating. Please contact Rogers Corporation directly for information on flame-retardant versions or specific compliance requirements for your application.

Q6: What is LoPro® foil and why would I use it?

A: LoPro® is a reverse-treated copper foil with a smoother surface profile compared to standard ED copper. It reduces conductor surface roughness, resulting in lower insertion loss at high frequencies. LoPro is particularly beneficial for millimeter-wave applications (5G, automotive radar at 77 GHz).

Q7: How do I control impedance with RO4003C?

A: With a tight Dk tolerance of ±0.05, RO4003C enables consistent impedance control. For a typical 50Ω microstrip on 0.008" RO4003C with 1 oz copper, the trace width is approximately 0.018"–0.020". We provide impedance test coupons with every order for verification.

Q8: What is the maximum operating temperature for RO4003C?

A: The material can withstand standard lead-free processing (peak ~260°C) and rework cycles (up to 288°C short-term). Continuous operating temperature is typically around 130°C for UL-listed applications. The high Tg >280°C ensures stable expansion characteristics across the entire processing temperature range.

Q9: Why does the design Dk decrease with thinner cores?

A: The design Dk value decreases by approximately 0.1 as the core thickness decreases from 0.020" to 0.004". This is due to the increased influence of the resin-rich layer at the copper interface on the overall dielectric constant. For accurate impedance design, please refer to Rogers' design guidelines or contact our team for assistance.

Q10: What is the typical lead time for custom RO4003C PCBs?

A: Lead times vary based on complexity and quantity. For 6-layer hybrid boards with blind vias and impedance control, typical lead times range from 12 to 20 working days. Please contact us for specific project timelines.

Ready to Get Started?

Whether you need RO4003C raw laminate, a hybrid stack-up design with FR-4, or a fully fabricated multilayer PCB with blind vias and impedance control, we are here to help.

Contact us today for:

Material sampling and testing

Hybrid stack-up design assistance

Impedance calculation and design support

Blind via design optimization

PCB quoting and DFM review

Technical support for your specific application