| Τροποποιημένο: | 1 ΤΕΜ |
| τιμή: | 0.99-99USD/PCS |
| τυποποιημένη συσκευασία: | Συσκευασία |
| Περίοδος παράδοσης: | 2-10 εργάσιμες ημέρες |
| μέθοδος πληρωμής: | T/T, Paypal |
| Ικανότητα εφοδιασμού: | 50000 ΤΕΜ |
FSD1020T High-Frequency Laminate & Custom PCB Product Introduction
Product Overview
The FSD1020T is a high-performance RF microwave laminate based on a low-loss hydrocarbon resin and nano-ceramic composite system, manufactured by leading domestic technology in China. It serves as an ideal alternative to traditional PTFE-based substrates, offering exceptional dielectric properties and thermal reliability for high-frequency and high-speed circuit designs.
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The core technological advantage of FSD1020T lies in its unique low-loss carbon-hydrogen nano-ceramic composite architecture. Compared to conventional PTFE materials, FSD1020T not only delivers outstanding high-frequency electrical performance but also provides superior mechanical workability and dimensional stability. The material complies with IPC-4103 standards, has achieved UL94 V-0 flame rating, and meets halogen-free and RoHS environmental requirements.
The FSD1020T exhibits stable and consistent dielectric constant along with extremely low dissipation factor at 10 GHz — a critical attribute for high-frequency signal transmission, as lower loss factor translates to reduced signal attenuation and superior transmission quality. The material also demonstrates excellent performance in millimeter-wave bands.
The high Tg (280°C) of FSD1020T ensures excellent heat resistance during lead-free soldering processes, while its low CTE values across all three axes provide outstanding dimensional stability and reliable plated through-hole (PTH) reliability. The material's superior CAF (Conductive Anodic Filament) resistance further enhances long-term reliability in high-voltage and high-humidity environments.
Key Technical Parameters
| Parameter | Test Condition | Typical Value |
| Dielectric Constant (Dk @ 10 GHz) | 23°C | 10.2 ± 0.2 |
| Dissipation Factor (Df @ 10 GHz) | 23°C | 0.0038 |
| Glass Transition Temperature (Tg) | — | 280°C |
| CTE (X/Y/Z-axis) | 30~260°C (TMA) | X<19, Y<19, Z<20 ppm/°C |
| Thermal Stress | 288°C / 10s | Pass visual inspection |
| Peel Strength | 288°C / 10s | 0.7 N/mm (4 lb/in) |
| Flame Resistance | UL94 | V0 |
| Volume Resistivity | Condition A | 2×10⁸ MΩ·cm |
| Surface Resistivity | Condition A | 4×10⁷ MΩ |
| Dielectric Breakdown Voltage | D-48/50+D-4/23 | 20 kV |
These outstanding insulation characteristics make FSD1020T particularly suitable for high-voltage and high-current RF power applications.
Application Fields
Surveying & mapping equipment
UAV (Unmanned Aerial Vehicle) control systems
Safety monitoring systems
Intelligent transportation systems
Machinery manufacturing
Ship-borne navigation systems
Driving test towers
High-power RF amplifiers and couplers
Low-noise amplifiers (LNAs) and power dividers
Antenna systems and feed networks
Custom PCB Specifications
Based on the FSD1020T laminate, we offer custom PCB fabrication with the following specifications for your high-frequency applications:
| Specification | Detail |
| Board Type | Double-sided PCB |
| Base Material | FSD1020T Laminate |
| Substrate Thickness | 0.508 mm |
| Board Dimensions | 96 × 47 mm (1 piece) |
| Copper Weight | 1 oz (35 µm) |
| Top Layer | Green solder mask (no silkscreen/nomenclature) |
| Bottom Layer | No solder mask, no nomenclature |
| Surface Finish | ENIG (Electroless Nickel / Immersion Gold) |
| Hole Size | 0.4 mm diameter |
| Hole Treatment | Resin plugging with capping |
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Design Advantages of This PCB Configuration
ENIG Surface Finish — Provides excellent solderability, oxidation resistance, and flatness, ensuring reliable component assembly and consistent RF signal integrity.
Resin Plugging with Capping for 0.4 mm Holes — Enhances via reliability, prevents solder wicking, and ensures robust interlayer connectivity essential for high-frequency circuit performance.
Selective Solder Mask Application — The top-layer green solder mask provides protection for critical circuitry, while the bottom layer remains unmasked to facilitate optimal thermal dissipation and grounding strategies.
Thin Substrate (0.508 mm) — Enables compact, lightweight designs ideal for space-constrained applications such as UAV control modules and portable safety monitoring devices.
Why Choose Our FSD1020T-Based PCBs?
Superior High-Frequency Performance — The inherent low-loss characteristics of FSD1020T ensure minimal signal degradation, making these boards ideal for applications operating at microwave frequencies.
High Thermal Reliability — With a Tg of 280°C, our PCBs withstand rigorous lead-free assembly processes and high-power operating conditions without compromising structural integrity.
Excellent Dimensional Stability — The low CTE of FSD1020T ensures reliable interconnections and consistent performance across varying temperature ranges.
Full Customization Capability — We offer complete design flexibility, from material selection to finished board specifications, tailored to your specific application requirements.
Cost-Effective Alternative — As a domestically manufactured material, FSD1020T delivers performance comparable to imported high-frequency laminates at a more competitive price point.
Quality Assurance
All our FSD1020T-based PCBs are manufactured under strict quality control standards. The base material meets IPC-4103 specifications and is UL94 V-0 rated, halogen-free, and RoHS compliant. Each board undergoes comprehensive electrical and mechanical testing to ensure consistent performance in demanding applications.
Note: All typical values listed are for reference only and are not for specification use. Please contact our company for detailed technical information and customized solutions.
Contact Information
We welcome inquiries regarding FSD1020T laminates, custom PCB fabrication, or any other high-frequency substrate requirements. Our technical team is ready to assist with material selection, design optimization, and manufacturing support for your specific applications.
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| Τροποποιημένο: | 1 ΤΕΜ |
| τιμή: | 0.99-99USD/PCS |
| τυποποιημένη συσκευασία: | Συσκευασία |
| Περίοδος παράδοσης: | 2-10 εργάσιμες ημέρες |
| μέθοδος πληρωμής: | T/T, Paypal |
| Ικανότητα εφοδιασμού: | 50000 ΤΕΜ |
FSD1020T High-Frequency Laminate & Custom PCB Product Introduction
Product Overview
The FSD1020T is a high-performance RF microwave laminate based on a low-loss hydrocarbon resin and nano-ceramic composite system, manufactured by leading domestic technology in China. It serves as an ideal alternative to traditional PTFE-based substrates, offering exceptional dielectric properties and thermal reliability for high-frequency and high-speed circuit designs.
![]()
The core technological advantage of FSD1020T lies in its unique low-loss carbon-hydrogen nano-ceramic composite architecture. Compared to conventional PTFE materials, FSD1020T not only delivers outstanding high-frequency electrical performance but also provides superior mechanical workability and dimensional stability. The material complies with IPC-4103 standards, has achieved UL94 V-0 flame rating, and meets halogen-free and RoHS environmental requirements.
The FSD1020T exhibits stable and consistent dielectric constant along with extremely low dissipation factor at 10 GHz — a critical attribute for high-frequency signal transmission, as lower loss factor translates to reduced signal attenuation and superior transmission quality. The material also demonstrates excellent performance in millimeter-wave bands.
The high Tg (280°C) of FSD1020T ensures excellent heat resistance during lead-free soldering processes, while its low CTE values across all three axes provide outstanding dimensional stability and reliable plated through-hole (PTH) reliability. The material's superior CAF (Conductive Anodic Filament) resistance further enhances long-term reliability in high-voltage and high-humidity environments.
Key Technical Parameters
| Parameter | Test Condition | Typical Value |
| Dielectric Constant (Dk @ 10 GHz) | 23°C | 10.2 ± 0.2 |
| Dissipation Factor (Df @ 10 GHz) | 23°C | 0.0038 |
| Glass Transition Temperature (Tg) | — | 280°C |
| CTE (X/Y/Z-axis) | 30~260°C (TMA) | X<19, Y<19, Z<20 ppm/°C |
| Thermal Stress | 288°C / 10s | Pass visual inspection |
| Peel Strength | 288°C / 10s | 0.7 N/mm (4 lb/in) |
| Flame Resistance | UL94 | V0 |
| Volume Resistivity | Condition A | 2×10⁸ MΩ·cm |
| Surface Resistivity | Condition A | 4×10⁷ MΩ |
| Dielectric Breakdown Voltage | D-48/50+D-4/23 | 20 kV |
These outstanding insulation characteristics make FSD1020T particularly suitable for high-voltage and high-current RF power applications.
Application Fields
Surveying & mapping equipment
UAV (Unmanned Aerial Vehicle) control systems
Safety monitoring systems
Intelligent transportation systems
Machinery manufacturing
Ship-borne navigation systems
Driving test towers
High-power RF amplifiers and couplers
Low-noise amplifiers (LNAs) and power dividers
Antenna systems and feed networks
Custom PCB Specifications
Based on the FSD1020T laminate, we offer custom PCB fabrication with the following specifications for your high-frequency applications:
| Specification | Detail |
| Board Type | Double-sided PCB |
| Base Material | FSD1020T Laminate |
| Substrate Thickness | 0.508 mm |
| Board Dimensions | 96 × 47 mm (1 piece) |
| Copper Weight | 1 oz (35 µm) |
| Top Layer | Green solder mask (no silkscreen/nomenclature) |
| Bottom Layer | No solder mask, no nomenclature |
| Surface Finish | ENIG (Electroless Nickel / Immersion Gold) |
| Hole Size | 0.4 mm diameter |
| Hole Treatment | Resin plugging with capping |
![]()
Design Advantages of This PCB Configuration
ENIG Surface Finish — Provides excellent solderability, oxidation resistance, and flatness, ensuring reliable component assembly and consistent RF signal integrity.
Resin Plugging with Capping for 0.4 mm Holes — Enhances via reliability, prevents solder wicking, and ensures robust interlayer connectivity essential for high-frequency circuit performance.
Selective Solder Mask Application — The top-layer green solder mask provides protection for critical circuitry, while the bottom layer remains unmasked to facilitate optimal thermal dissipation and grounding strategies.
Thin Substrate (0.508 mm) — Enables compact, lightweight designs ideal for space-constrained applications such as UAV control modules and portable safety monitoring devices.
Why Choose Our FSD1020T-Based PCBs?
Superior High-Frequency Performance — The inherent low-loss characteristics of FSD1020T ensure minimal signal degradation, making these boards ideal for applications operating at microwave frequencies.
High Thermal Reliability — With a Tg of 280°C, our PCBs withstand rigorous lead-free assembly processes and high-power operating conditions without compromising structural integrity.
Excellent Dimensional Stability — The low CTE of FSD1020T ensures reliable interconnections and consistent performance across varying temperature ranges.
Full Customization Capability — We offer complete design flexibility, from material selection to finished board specifications, tailored to your specific application requirements.
Cost-Effective Alternative — As a domestically manufactured material, FSD1020T delivers performance comparable to imported high-frequency laminates at a more competitive price point.
Quality Assurance
All our FSD1020T-based PCBs are manufactured under strict quality control standards. The base material meets IPC-4103 specifications and is UL94 V-0 rated, halogen-free, and RoHS compliant. Each board undergoes comprehensive electrical and mechanical testing to ensure consistent performance in demanding applications.
Note: All typical values listed are for reference only and are not for specification use. Please contact our company for detailed technical information and customized solutions.
Contact Information
We welcome inquiries regarding FSD1020T laminates, custom PCB fabrication, or any other high-frequency substrate requirements. Our technical team is ready to assist with material selection, design optimization, and manufacturing support for your specific applications.
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