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Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

Τροποποιημένο: 1 PCS
τιμή: 0.99-99USD/PCS
τυποποιημένη συσκευασία: Συσκευασία
Περίοδος παράδοσης: 2-10 εργάσιμες ημέρες
μέθοδος πληρωμής: T/t, paypal
Ικανότητα εφοδιασμού: 50000pcs
Πληροφορίες λεπτομέρειας
Μάρκα
Rogers
Ποσότητα παραγγελίας min:
1 PCS
Τιμή:
0.99-99USD/PCS
Συσκευασία λεπτομέρειες:
Συσκευασία
Χρόνος παράδοσης:
2-10 εργάσιμες ημέρες
Όροι πληρωμής:
T/t, paypal
Δυνατότητα προσφοράς:
50000pcs
Περιγραφή του προϊόντος

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 

Overview of the 4-Layer Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is a high-performance solution designed for demanding applications in aerospace, military, and high-temperature electronics. Built with polyimide material, this PCB exhibits exceptional thermal stability, high-frequency dielectric performance, and mechanical strength.

 

With a 1.8mm thickness, HASL lead-free surface finish, and black solder mask, this PCB is engineered for reliability and durability in extreme environments. Its resin-filled and capped vias and countersunk holes make it ideal for precision applications requiring high mechanical and electrical performance.

 

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance 0

 

PCB Construction Details

The 4-layer rigid Polyimide PCB is manufactured to strict standards, ensuring durability, stability, and consistent performance. Below are the detailed construction specifications:

Parameter Specification
Base Material Rigid Polyimide
Layer Count 4 layers
Board Dimensions 325mm x 83mm ± 0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Blind Vias No
Via Plating Thickness 20 μm
Finished Board Thickness 1.8mm
Copper Weight 1oz (1.4 mils) outer layers
Surface Finish HASL lead-free
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Black
Bottom Solder Mask Black
Special Features Resin-filled and capped vias, countersunk holes
Electrical Testing 100% tested prior to shipment

 

 

 

PCB Stackup

The 4-layer stackup is engineered to deliver thermal robustness, electrical stability, and high-frequency performance. Below is the detailed layer structure:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material Polyimide Core 0.32mm
Copper Layer 2 Copper (1oz) 35 μm
Prepreg Polyimide Prepreg 0.1mm
Core Material Polyimide Core 0.8mm
Prepreg Polyimide Prepreg 0.1mm
Copper Layer 3 Copper (1oz) 35 μm
Core Material Polyimide Core 0.32mm
Copper Layer 4 Copper (1oz) 35 μm

 

 

 

PCB Statistics

The 4-layer rigid Polyimide PCB is optimized for complex designs and high-density layouts. Below are its key statistics:

  • Components: 68
  • Total Pads: 102
  • Thru Hole Pads: 47
  • Top SMT Pads: 39
  • Bottom SMT Pads: 16
  • Vias: 121
  • Nets: 12

 

 

 

Introduction to Rigid Polyimide Material

Polyimide is a high-performance polymer known for its thermal stability, mechanical strength, and excellent electrical insulation properties. Its unique properties make it ideal for high-temperature, high-frequency, and mechanically demanding environments.

 

Key attributes include:

  • Thermal Stability: Maintains integrity under extreme temperatures, passing 288°C thermal stress tests without delamination or blistering.
  • Electrical Insulation: High volume resistivity (6.6×10⁸ MΩ·cm) and surface resistivity (3.4×10⁷ MΩ) ensure reliable performance.
  • Moisture Resistance: Low absorption rate (0.11%) prevents performance degradation in humid environments.
  • Mechanical Strength: Strong bending strength (410.2 N/mm²) ensures durability in dynamic applications.

 

 

Features of Rigid Polyimide Material

  • Dielectric Constant (Dk): 4.12 at 1MHz
  • Dissipation Factor: 0.0072 at 1MHz
  • Thermal Stress: Withstands 288°C without delamination or blistering
  • Flammability: UL-94 V0
  • Moisture Absorption: 0.11%
  • Dielectric Breakdown Voltage: 44.3 kV
  • Glass Transition Temperature (Tg): 257°C

 

 

Benefits of Rigid Polyimide PCB

  1. Exceptional Thermal Resistance: Withstands high temperatures for aerospace and military applications.
  2. High Dielectric Performance: Maintains stability for high-frequency circuits.
  3. Mechanical Durability: Strong peel and bending strength for reliability in demanding environments.
  4. Moisture Resistance: Prevents performance degradation in humid conditions.
  5. Low Dielectric Loss: Ensures high signal integrity for sensitive applications.

 

 

Applications of Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is engineered for high-performance applications across industries, including:

Aerospace Equipment: Ensures reliability in extreme environments.

Military Electronics: Ideal for radar, communication, and defense systems.

High-Temperature Applications: Withstands temperatures up to 288°C.

Downhole Oil Extraction Electronics: Performs reliably in harsh conditions.

High-Frequency Circuits: Provides stable dielectric properties for RF applications.

 

 

Why Choose the 4-Layer Rigid Polyimide PCB?

The 4-layer rigid Polyimide PCB is the ideal choice for critical high-temperature and high-frequency applications. Its 1.8mm thickness, HASL finish, and resin-filled vias ensure mechanical robustness, electrical stability, and long-term reliability.

 

Contact us today to learn more about this high-performance PCB or to place an order for your project!

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance 1

 

Συνιστώμενα προϊόντα
προϊόντα
λεπτομέρειες για τα προϊόντα
Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance
Τροποποιημένο: 1 PCS
τιμή: 0.99-99USD/PCS
τυποποιημένη συσκευασία: Συσκευασία
Περίοδος παράδοσης: 2-10 εργάσιμες ημέρες
μέθοδος πληρωμής: T/t, paypal
Ικανότητα εφοδιασμού: 50000pcs
Πληροφορίες λεπτομέρειας
Μάρκα
Rogers
Ποσότητα παραγγελίας min:
1 PCS
Τιμή:
0.99-99USD/PCS
Συσκευασία λεπτομέρειες:
Συσκευασία
Χρόνος παράδοσης:
2-10 εργάσιμες ημέρες
Όροι πληρωμής:
T/t, paypal
Δυνατότητα προσφοράς:
50000pcs
Περιγραφή του προϊόντος

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 

Overview of the 4-Layer Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is a high-performance solution designed for demanding applications in aerospace, military, and high-temperature electronics. Built with polyimide material, this PCB exhibits exceptional thermal stability, high-frequency dielectric performance, and mechanical strength.

 

With a 1.8mm thickness, HASL lead-free surface finish, and black solder mask, this PCB is engineered for reliability and durability in extreme environments. Its resin-filled and capped vias and countersunk holes make it ideal for precision applications requiring high mechanical and electrical performance.

 

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance 0

 

PCB Construction Details

The 4-layer rigid Polyimide PCB is manufactured to strict standards, ensuring durability, stability, and consistent performance. Below are the detailed construction specifications:

Parameter Specification
Base Material Rigid Polyimide
Layer Count 4 layers
Board Dimensions 325mm x 83mm ± 0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Blind Vias No
Via Plating Thickness 20 μm
Finished Board Thickness 1.8mm
Copper Weight 1oz (1.4 mils) outer layers
Surface Finish HASL lead-free
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Black
Bottom Solder Mask Black
Special Features Resin-filled and capped vias, countersunk holes
Electrical Testing 100% tested prior to shipment

 

 

 

PCB Stackup

The 4-layer stackup is engineered to deliver thermal robustness, electrical stability, and high-frequency performance. Below is the detailed layer structure:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material Polyimide Core 0.32mm
Copper Layer 2 Copper (1oz) 35 μm
Prepreg Polyimide Prepreg 0.1mm
Core Material Polyimide Core 0.8mm
Prepreg Polyimide Prepreg 0.1mm
Copper Layer 3 Copper (1oz) 35 μm
Core Material Polyimide Core 0.32mm
Copper Layer 4 Copper (1oz) 35 μm

 

 

 

PCB Statistics

The 4-layer rigid Polyimide PCB is optimized for complex designs and high-density layouts. Below are its key statistics:

  • Components: 68
  • Total Pads: 102
  • Thru Hole Pads: 47
  • Top SMT Pads: 39
  • Bottom SMT Pads: 16
  • Vias: 121
  • Nets: 12

 

 

 

Introduction to Rigid Polyimide Material

Polyimide is a high-performance polymer known for its thermal stability, mechanical strength, and excellent electrical insulation properties. Its unique properties make it ideal for high-temperature, high-frequency, and mechanically demanding environments.

 

Key attributes include:

  • Thermal Stability: Maintains integrity under extreme temperatures, passing 288°C thermal stress tests without delamination or blistering.
  • Electrical Insulation: High volume resistivity (6.6×10⁸ MΩ·cm) and surface resistivity (3.4×10⁷ MΩ) ensure reliable performance.
  • Moisture Resistance: Low absorption rate (0.11%) prevents performance degradation in humid environments.
  • Mechanical Strength: Strong bending strength (410.2 N/mm²) ensures durability in dynamic applications.

 

 

Features of Rigid Polyimide Material

  • Dielectric Constant (Dk): 4.12 at 1MHz
  • Dissipation Factor: 0.0072 at 1MHz
  • Thermal Stress: Withstands 288°C without delamination or blistering
  • Flammability: UL-94 V0
  • Moisture Absorption: 0.11%
  • Dielectric Breakdown Voltage: 44.3 kV
  • Glass Transition Temperature (Tg): 257°C

 

 

Benefits of Rigid Polyimide PCB

  1. Exceptional Thermal Resistance: Withstands high temperatures for aerospace and military applications.
  2. High Dielectric Performance: Maintains stability for high-frequency circuits.
  3. Mechanical Durability: Strong peel and bending strength for reliability in demanding environments.
  4. Moisture Resistance: Prevents performance degradation in humid conditions.
  5. Low Dielectric Loss: Ensures high signal integrity for sensitive applications.

 

 

Applications of Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is engineered for high-performance applications across industries, including:

Aerospace Equipment: Ensures reliability in extreme environments.

Military Electronics: Ideal for radar, communication, and defense systems.

High-Temperature Applications: Withstands temperatures up to 288°C.

Downhole Oil Extraction Electronics: Performs reliably in harsh conditions.

High-Frequency Circuits: Provides stable dielectric properties for RF applications.

 

 

Why Choose the 4-Layer Rigid Polyimide PCB?

The 4-layer rigid Polyimide PCB is the ideal choice for critical high-temperature and high-frequency applications. Its 1.8mm thickness, HASL finish, and resin-filled vias ensure mechanical robustness, electrical stability, and long-term reliability.

 

Contact us today to learn more about this high-performance PCB or to place an order for your project!

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance 1

 

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