High DK value 16 2-Layer TP1600 ceramic-filled PPO PCB | 0.8mm dielectric laminate | Pure Gold Plating

2-Layer TP1600 PCB | 0.8mm Core | Pure Gold Plating

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's TP1600 high-performance microwave composite dielectric laminate. As a specialized member of the TP series, this material features a ceramic-filled polyphenylene oxide (PPO) resin matrix with no fiberglass reinforcement, offering a uniquely smooth surface and uniform electrical performance.

The board measures 75mm x 68mm (single piece) with a finished thickness of 0.9mm (including 0.8mm core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are 4/6 mils (finer than typical RF designs), with a minimum finished hole size of 0.2mm. No blind vias are used in this construction.

This design features green solder mask on both sides for circuit protection and insulation, along with white silkscreen on both sides for clear component identification. The Pure Gold Plating surface finish provides an ultra-flat, corrosion-resistant surface with excellent solderability and wire bondability, making it ideal for high-reliability applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages: TP1600

The TP1600 is a specialized high-frequency microwave composite dielectric copper-clad laminate (CCL) from Taizhou Wangling Insulation Material Factory. The model number directly indicates its nominal dielectric constant of 16.0. The dielectric constant is precisely adjusted by modifying the ratio of ceramic to PPO resin, with the production process offering excellent dielectric properties and high reliability.

Key material highlights:

No fiberglass reinforcement – eliminates glass weave effects on electromagnetic wave propagation, providing a smooth surface and uniform electrical performance

High Dk (16.0 ±0.32) – enables significant circuit size reduction for compact antennas and resonant structures

Ultra-low dissipation factor (0.0012 at 5GHz) – minimal loss variation up to 10 GHz

Excellent low-temperature performance – long-term operating temperature from -100°C to +150°C

Radiation-resistant & low outgassing – ideal for aerospace, satellite, and military applications

Easier machining than pure ceramics – can be drilled, turned, ground, sheared, and etched

Critical Processing Notes:

No wave soldering – material is not suitable for 260°C thermal shock testing

Reflow soldering max temperature ≤ 200°C – standard reflow profiles may cause deformation or copper delamination

Hand soldering recommended – use constant-temperature soldering iron

Multilayer processing not generally recommended – if necessary, use low-temperature bonding sheets and conduct thorough feasibility review

The TP series includes TP (unclad, smooth surface), TP-1 (single-sided copper), and TP-2 (double-sided copper). TP1600 is the double-sided copper version with 1 oz ED copper foil.

TP1600 Material Properties

PCB Stackup & Construction

The board features a 2-layer stackup:

Top Copper (Layer 1): 1 oz (35μm) – ED copper foil

Dielectric Core: TP1600 – 0.8mm (31.49 mils)

Bottom Copper (Layer 2): 1 oz (35μm) – ED copper foil

Total Finished Thickness: 0.9mm

Minimum trace and space are 4/6 mils, with a minimum finished hole size of 0.2mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 34 components, 56 total pads (29 thru-hole, 27 top SMT), 34 vias, and 2 nets.

The green solder mask on both sides provides circuit protection and insulation, while the white silkscreen on both sides enables clear component identification.

Typical Applications

Thanks to its high Dk (16.0), ultra-low loss (0.0012), and excellent reliability, this PCB is ideally suited for:

Miniaturized antennas – Beidou navigation, compact RF systems

RF/microwave filters, couplers, and resonant cavities

Aerospace and defense electronics – missile-borne systems, fuzes

Satellite payloads and navigation systems

High-frequency sensor modules requiring stable high-Dk performance

Phase-sensitive electronic structures

Available Configurations

TP1600 is available with ED copper foil in thicknesses of 0.018mm and 0.035mm (1 oz). Standard panel sizes include 150×150mm, 160×160mm, 200×200mm, and 170×240mm, with custom dimensions available upon request. Thickness options range from 0.8mm to 12.0mm with corresponding tolerances.

For applications requiring shielding or enhanced heat dissipation, the TP series can also be supplied with aluminum or copper backing (contact our sales team for availability).

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. Please note the special processing requirements for TP1600 (no wave soldering, reflow ≤200°C). For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.