Rogers RO4350B LoPro laminate raw material Double-Sided Copper Clad Laminate for multi-layer hybrid PCB using in RF Microwave

Double-Sided Copper Clad Laminate with Rogers RO4350B LoPro

Rogers RO4350B LoPro is an advanced hydrocarbon ceramic laminate with a low-profile reverse-treated copper foil. This innovative material reduces conductor loss, improving insertion loss and signal integrity for high-performance designs. The RO4350B LoPro laminate maintains all the benefits of standard RO4350B materials while offering better electrical and thermal performance. Designed to be fabricated using standard FR-4 processes, it eliminates the need for specialized via preparation methods, such as sodium etching, enabling cost-effective manufacturing.

The double-sided copper clad laminate, made with Rogers RO4350B Low Profile (LoPro) material, is a high-performance solution for RF, microwave, and high-speed digital applications. The 1.6mm finished thickness, combined with a 60.7mil (1.542mm) RO4350B LoPro substrate, ensures excellent signal integrity, low conductor loss, and thermal reliability. Compatible with standard FR-4 fabrication processes, this laminate provides a cost-effective, high-frequency solution without requiring specialized manufacturing techniques.

Key Construction Details

PCB Stackup

The 2-layer rigid PCB stackup features a 60.7mil RO4350B LoPro substrate between two copper layers, optimized for high-frequency signal performance and thermal reliability.

Why Choose Rogers RO4350B LoPro?

• Low Conductor Loss: The low-profile copper ensures minimal signal loss for high-frequency designs.
• Cost-Effective Production: Compatible with standard FR-4 processes, reducing fabrication costs.
• Thermal Reliability: With a high decomposition temperature (Td > 390°C), it withstands high-power and high-temperature environments.
• High-Frequency Performance: The low dissipation factor (Df = 0.0037 @ 10GHz) ensures superior signal integrity for applications exceeding 40GHz.

Key Features of Rogers RO4350B LoPro Copper Clad Laminate

1. Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz, ensuring controlled and consistent signal propagation in high-frequency designs.
2. Low Dissipation Factor (Df): 0.0037 at 10GHz, enabling efficient operation with minimal signal loss.
3. Thermal Stability: High thermal decomposition temperature (Td > 390°C) and Tg > 280°C, ensuring reliable performance under extreme heat.
4. Low Z-Axis CTE: 32 ppm/°C, providing excellent dimensional stability and reducing the risk of delamination during thermal cycling.
5. High Thermal Conductivity: 0.69 W/mK, ensuring effective heat dissipation for high-power designs.
6. Reverse-Treated Copper Foil: Minimizes conductor loss for improved signal integrity and insertion loss performance.
7. Lead-Free Process Compatibility: Fully compatible with modern, environmentally friendly manufacturing processes.

Processing Advantages

1. Standard Fabrication Compatibility

The laminate supports FR-4 processes, eliminating the need for specialized fabrication techniques like sodium etching, reducing costs and complexity.

2. High-Temperature Processing

Its high Tg (>280°C) and Td (>390°C) make it compatible with lead-free soldering processes, ensuring thermal reliability.

3. Improved Signal Integrity

The reverse-treated copper minimizes conductor loss, ensuring low insertion loss and stable signal performance at high frequencies.

4. Dimensional Stability

The low Z-axis CTE (32 ppm/°C) ensures reliability during thermal cycling, reducing risks of warping or delamination.

Some Typical Applications
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB’s for direct broadcast satellites
- RF Identification Tags

Conclusion

The double-sided copper clad laminate with Rogers RO4350B LoPro is an advanced material optimized for high-frequency RF, microwave, and digital applications. Its low dissipation factor, thermal reliability, and compatibility with standard FR-4 processes make it a preferred choice for cellular base stations, satellite systems, and high-speed digital circuits. While its higher cost may limit its use in general-purpose designs, its superior performance and environmental compliance ensure reliable operation for next-generation high-frequency systems.