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Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers

Τροποποιημένο: 1 PCS
τιμή: 0.99-99USD/PCS
τυποποιημένη συσκευασία: Συσκευασία
Περίοδος παράδοσης: 2-10 εργάσιμες ημέρες
μέθοδος πληρωμής: T/t, paypal
Ικανότητα εφοδιασμού: 50000pcs
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής
Κίνα
Μάρκα
Rogers
Πιστοποίηση
ISO9001
Αριθμό μοντέλου
TMM3
Ποσότητα παραγγελίας min:
1 PCS
Τιμή:
0.99-99USD/PCS
Συσκευασία λεπτομέρειες:
Συσκευασία
Χρόνος παράδοσης:
2-10 εργάσιμες ημέρες
Όροι πληρωμής:
T/t, paypal
Δυνατότητα προσφοράς:
50000pcs
Περιγραφή του προϊόντος

What circuit boards do we do? (49)

TMM3 Microwave PCB

 

Introduction

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite specifically engineered for strip-line and micro-strip applications requiring high plated thru-hole reliability.

 

TMM3 laminates offer a unique blend of advantages found in both ceramic and traditional PTFE microwave circuit laminates, eliminating the need for complex production techniques associated with these materials. These laminates leverage thermoset resins, ensuring exceptional reliability for wire-bonding processes while mitigating concerns such as pad lifting or substrate deformation.

 

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers 0

 

Features & Benefits

TMM3 laminates possess a dielectric constant (Dk) of 3.27 +/- .032, ensuring precise and consistent signal transmission, exhibiting a dissipation factor of just .002 at 10GHz. This low dissipation factor ensures that the PCBs experience minimal signal loss, enabling efficient and effective communication within the circuitry.

 

The thermal coefficient of Dk is 37ppm/°K, providing stability even in varying temperature conditions. Moreover, the coefficient of thermal expansion is precisely matched to copper, mitigating potential issues related to thermal stress.

 

TMM3 materials possess mechanical properties that resist creep and cold flow, ensuring long-term reliability. They are also resistant to process chemicals, reducing the risk of damage during fabrication. Additionally, it eliminates the need for a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process.

 

 

Capability

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers 1

In terms of our PCB capabilities on TMM3 substrates, we can offer a wide range of options to meet your specific requirements.

 

Whether you need double layer, multilayer, or hybrid PCBs, we have you covered.

 

You can select from different copper weights, including 0.5oz (17 µm), 1oz (35µm), and 2oz (70µm), to achieve optimal conductivity.

 

Our PCB thickness options range from 15mil (0.381mm) to 500mil (12.7mm), catering to various application needs.

 

The maximum PCB size we can handle is 400mm X 500mm. We offer a variety of solder mask colors, such as green, black, blue, yellow, and red.

 

Additionally, you can choose from a range of surface finishes, including bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, pure gold, and ENEPIG.

 

 

Applications

TMM3 Microwave PCBs find extensive applications in various industries. They are perfect for RF and microwave circuitry, power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, dielectric polarizers and lenses, as well as chip testers.

 

Thank you. See you next time.

 

Συνιστώμενα προϊόντα
προϊόντα
λεπτομέρειες για τα προϊόντα
Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers
Τροποποιημένο: 1 PCS
τιμή: 0.99-99USD/PCS
τυποποιημένη συσκευασία: Συσκευασία
Περίοδος παράδοσης: 2-10 εργάσιμες ημέρες
μέθοδος πληρωμής: T/t, paypal
Ικανότητα εφοδιασμού: 50000pcs
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής
Κίνα
Μάρκα
Rogers
Πιστοποίηση
ISO9001
Αριθμό μοντέλου
TMM3
Ποσότητα παραγγελίας min:
1 PCS
Τιμή:
0.99-99USD/PCS
Συσκευασία λεπτομέρειες:
Συσκευασία
Χρόνος παράδοσης:
2-10 εργάσιμες ημέρες
Όροι πληρωμής:
T/t, paypal
Δυνατότητα προσφοράς:
50000pcs
Περιγραφή του προϊόντος

What circuit boards do we do? (49)

TMM3 Microwave PCB

 

Introduction

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite specifically engineered for strip-line and micro-strip applications requiring high plated thru-hole reliability.

 

TMM3 laminates offer a unique blend of advantages found in both ceramic and traditional PTFE microwave circuit laminates, eliminating the need for complex production techniques associated with these materials. These laminates leverage thermoset resins, ensuring exceptional reliability for wire-bonding processes while mitigating concerns such as pad lifting or substrate deformation.

 

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers 0

 

Features & Benefits

TMM3 laminates possess a dielectric constant (Dk) of 3.27 +/- .032, ensuring precise and consistent signal transmission, exhibiting a dissipation factor of just .002 at 10GHz. This low dissipation factor ensures that the PCBs experience minimal signal loss, enabling efficient and effective communication within the circuitry.

 

The thermal coefficient of Dk is 37ppm/°K, providing stability even in varying temperature conditions. Moreover, the coefficient of thermal expansion is precisely matched to copper, mitigating potential issues related to thermal stress.

 

TMM3 materials possess mechanical properties that resist creep and cold flow, ensuring long-term reliability. They are also resistant to process chemicals, reducing the risk of damage during fabrication. Additionally, it eliminates the need for a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process.

 

 

Capability

Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite engineered for power amplifiers 1

In terms of our PCB capabilities on TMM3 substrates, we can offer a wide range of options to meet your specific requirements.

 

Whether you need double layer, multilayer, or hybrid PCBs, we have you covered.

 

You can select from different copper weights, including 0.5oz (17 µm), 1oz (35µm), and 2oz (70µm), to achieve optimal conductivity.

 

Our PCB thickness options range from 15mil (0.381mm) to 500mil (12.7mm), catering to various application needs.

 

The maximum PCB size we can handle is 400mm X 500mm. We offer a variety of solder mask colors, such as green, black, blue, yellow, and red.

 

Additionally, you can choose from a range of surface finishes, including bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, pure gold, and ENEPIG.

 

 

Applications

TMM3 Microwave PCBs find extensive applications in various industries. They are perfect for RF and microwave circuitry, power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, dielectric polarizers and lenses, as well as chip testers.

 

Thank you. See you next time.

 

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